A semiconductor package comprises: a printed circuit board; and a semiconductor chip mounted on the printed circuit board. The printed circuit board comprises: at least one power or ground pattern layer formed in the printed circuit board; at least one power or ground pad formed on a lower surface of the printed circuit board; at least one electric conductive via extended from the power or ground pattern layer to the lower surface of the printed circuit board to be connected to the power or ground pad; and at least one thermally conductive via extended from the power or ground pattern layer to an upper surface of the printed circuit board to be exposed to the outside of the printed circuit board. The thermally conductive via is located in an area overlapping the semiconductor chip on a plan view.
