| 摘要 |
The invention relates to an LED module (2, 8), comprising an assembly of electronically connected LEDs (3, 10) and a carrier (7, 9) for the LEDs, wherein the density of the LEDs (3, 10) is selected in such a way that the thermal load on the carrier (7, 9) caused by the operation of the LEDs (3, 10) is distributed evenly over the carrier (7, 9). |
