| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for an optical semiconductor device capable of constituting an optical semiconductor device in which constraints on manufacture are excluded, electrical connection reliability is improved, and reflectivity of light emitted from an optical semiconductor element in bottom direction is improved, and provide an optical semiconductor device using the lead frame, and a method of manufacturing them.SOLUTION: A lead frame for an optical semiconductor device includes an electrode part connected to an optical semiconductor element and a side wall part disposed on an outer periphery of a side surface of the optical semiconductor element. The electrode part is disposed on the optical semiconductor element. The light that is emitted from the optical semiconductor element in bottom direction is caused to be reflected upward by a member different from the lead frame for the optical semiconductor device. |
