发明名称 レーザー加工装置
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of suppressing reduction in working efficiency by decreasing a downtime in machining as much as possible. <P>SOLUTION: The laser beam machining device 1 includes a chuck table 10 for holding a workpiece W, a laser beam irradiation means 20 for irradiating laser beam to a surface of the workpiece W, and a powder dust discharge means 60 arranged at an end part of a condenser 22 for sucking/discharging powder dust generated near a machining point. The device 1 also includes an output measurement means 50 for measuring output of laser beam, a powder dust processing device for catching powder dust contained in exhaust gas and discharging only the exhaust gas, an opening/closing valve arranged between the powder dust discharge means 60 and the powder dust processing device, and a control means 90. When measuring the output of the laser beam, the control means 90 closes the opening/closing valve. When performing laser machining of the workpiece W, the opening/closing valve is opened. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5868118(B2) 申请公布日期 2016.02.24
申请号 JP20110235427 申请日期 2011.10.26
申请人 株式会社ディスコ 发明人 遠藤 智章
分类号 B23K26/16;B23K26/00;B23K26/36 主分类号 B23K26/16
代理机构 代理人
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