| 摘要 |
The present invention relates to a coating agent composition for the direct laser structuralization, a thermoplastic resin composition, and a direct laser structuralization method using the coating agent composition. More specifically, the present invention relates to a composition for the direct laser structuralization, which enables weight lightening and increases economic feasibility. To this end, the coating agent composition for the direct laser structuralization or the thermoplastic resin composition is produced by adding an additive capable of increasing heat resistance, so as to carry out the direct laser structuralization. Thus, a molding structure and a circuit can be integrally composed together, leading to the simplification of processes and reduction in the number of parts. |
