PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to a printed circuit board and a method of manufacturing the same. The printed circuit board according to the embodiment of the present invention includes an insulating layer with a via hole, a via which is formed in the via hole, a first circuit pattern which is formed in the lower part of the insulating layer and is electrically connected to the via, and a second circuit pattern which is formed in the upper part of the insulating layer and is bonded to the via. The diameter of the via is smaller than that of the via hole.