| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board capable of reducing inclination of an electrode on a top face around a recess, and a wiring board. <P>SOLUTION: A manufacturing method of a wiring board comprises the steps of: preparing a first ceramic green sheet 1 and a second ceramic green sheet 2; providing a low shrinkage member 3; manufacturing a laminate 7 by laminating the second ceramic green sheet 2 on a top face of the first ceramic green sheet 1; and burning the laminate 7. The first ceramic sheet 1 has a first through hole 1a. The second ceramic green sheet 2 has a second through hole 2a smaller than the first through hole 1a. The low shrinkage member 3 has a burning shrinkage ratio smaller than the first ceramic green sheet 1 and is provided in the first through hole 1a. The laminate 7 is manufactured by laminating the second ceramic green sheet 2 on the top face of the first ceramic green sheet 1 so that the first through hole 1a overlaps with the second through hole 2a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
