| 摘要 |
An image pickup apparatus 40 includes a laminated substrate 46 on which a plurality of electronic components 55 to 58 configuring a driving circuit of a solid-state image pickup device 44 are mounted and in which a plurality of conductor layers 76 to 78 and a plurality of vias 71 to 75 are formed, electronic component connection lands 61 and 62 provided on a surface of the laminated substrate 46, any one of the plurality of electronic components 55 to 58 being electrically connected to the electronic component connection lands 61 and 62, and a cable connection land 63 provided on the surface of the laminated substrate 46, a plurality of signal cables 48 being electrically connected to the cable connection land 63. At least one of the plurality of electronic components 55 to 58 is embedded in a position superimposed on the electronic component connection lands 61 and 62 or the cable connection land 63 on an inside of the laminated substrate 46. |
