| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board for forming a cover layer from a resin material to which adhesiveness is given by modifying maleic acid anhydride co-polymerized to thermoplastic fluororesin, and the wiring board.SOLUTION: A cover layer 3 is formed by performing heating processing while laminating, to at least one principal surface of a wiring layer 2, a fluororesin material containing a reactant resulting from partially or entirely reacting maleic acid anhydride co-polymerized to thermoplastic fluororesin with an amine compound or a fluororesin material containing a reactant resulting from partially or entirely reacting maleic acid anhydride with an epoxy compound. Therefore, adhesiveness can be given to the fluororesin material forming the cover layer 3 by modifying maleic acid anhydride co-polymerized to thermoplastic fluororesin. Thus, even without using an adhesive such as epoxy resin like the prior arts, the cover layer 3 can be formed on the wiring layer 2 from the fluororesin material improved in chemical resistance and weather resistance. |
