发明名称 MEMSデバイス
摘要 <P>PROBLEM TO BE SOLVED: To provide a technique capable of preventing bending of a substrate, in a MEMS device including the substrate and a movable part. <P>SOLUTION: A MEMS device including a substrate and a movable part movable relative to the substrate is disclosed. The MEMS device includes a lower conductive layer, an intermediate insulating layer, and an upper conductive layer. The lower conductive layer is formed so as to be thicker than the upper conductive layer. A bending prevention layer is formed at the outer side of the lower conductive layer. The bending prevention layer is formed in a range corresponding to the intermediate insulating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5867057(B2) 申请公布日期 2016.02.24
申请号 JP20110276119 申请日期 2011.12.16
申请人 株式会社豊田中央研究所 发明人 藤吉 基弘;野々村 裕;大村 義輝;船橋 博文;明石 照久;畑 良幸
分类号 B81B3/00;G01P15/125;H01L21/822;H01L27/04;H01L29/84 主分类号 B81B3/00
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