DIGITAL RADIATION SENSOR PACKAGE

摘要

A radiation detection apparatus comprises a radiation sensor chip, an integrated circuit chip located under the radiation sensor chip; and an optical element located on the radiation sensor chip, which are vertically stacked. The radiation sensor chip comprises a radiation detection element and an electrically conductive contact coupled with the radiation detection element, and exposed on the lower surface. The integrated circuit chip comprises an integrated circuit and an electric conductor coupled with the integrated circuit, and exposed on the upper surface. The electrically conductive contact on the lower surface of the radiation sensor chip is physically and electrically coupled with the electric conductor on the upper surface of the integrated circuit chip. The optical element is formed to pass received radiation in the wavelength that the radiation detection element detects.