发明名称 |
Bonded semiconductor structure with SiGeC/SiGeBC layer as etch stop |
摘要 |
A semiconductor structure is formed with a first wafer (e.g. a handle wafer) and a second wafer (e.g. a bulk silicon wafer) bonded together. The second wafer includes an active layer, which in some embodiments is formed before the two wafers are bonded together. A substrate is removed from the second wafer on an opposite side of the active layer from the first wafer using a SiGeC or SiGeBC layer as an etch stop. In some embodiments, the SiGeC or SiGeBC layer is formed by epitaxial growth, ion implantation or a combination of epitaxial growth and ion implantation. |
申请公布号 |
US9269608(B2) |
申请公布日期 |
2016.02.23 |
申请号 |
US201514673309 |
申请日期 |
2015.03.30 |
申请人 |
QUALCOMM SWITCH CORP. |
发明人 |
Fanelli Stephen A. |
分类号 |
H01L21/30;H01L21/46;H01L21/762;H01L29/78 |
主分类号 |
H01L21/30 |
代理机构 |
Haynes and Boone LLP |
代理人 |
Haynes and Boone LLP |
主权项 |
1. A method comprising:
forming a first wafer having a first bonding material; forming a second wafer having a substrate, a SiGeBC layer, an active layer and a second bonding material, the active layer being between the SiGeBC layer and the second bonding material; bonding the second wafer to the first wafer at the first and second bonding materials; and removing the substrate using the SiGeBC layer as an etch stop. |
地址 |
San Diego CA US |