发明名称 |
Pattern generating method, pattern forming method, and pattern generating program |
摘要 |
One embodiment includes: a step of evaluating an amount of flare occurring through a mask at EUV exposure; a step of providing a dummy mask pattern on the mask based on the evaluated result of the amount of flare; and a step of executing a flare correction and an optical proximity correction on a layout pattern. The layout pattern is provided by the EUV exposure through the mask with the dummy mask pattern. |
申请公布号 |
US9268208(B2) |
申请公布日期 |
2016.02.23 |
申请号 |
US201213421688 |
申请日期 |
2012.03.15 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Aburada Ryota;Mashita Hiromitsu;Uno Taiga;Miyairi Masahiro;Kotani Toshiya |
分类号 |
G03B27/42;G03B27/54;G03B27/68;G03F1/36;G03F7/20;G03F1/70 |
主分类号 |
G03B27/42 |
代理机构 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
代理人 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
主权项 |
1. A pattern generating method comprising:
evaluating an amount of flare occurring through a mask at EUV exposure, the mask having a main mask pattern; providing a dummy mask pattern on the mask based on the evaluated result of the amount of flare; executing a flare correction and an optical proximity correction on a layout pattern formed by the EUV exposure through the mask with the dummy mask pattern; and executing a bias process on the main mask pattern of the mask to thicken a line width of the main mask pattern by an amount of line width that is to be removed by a slimming process that removes a dummy layout pattern on a wafer formed corresponding to the dummy mask pattern. |
地址 |
Tokyo JP |