发明名称 Pattern generating method, pattern forming method, and pattern generating program
摘要 One embodiment includes: a step of evaluating an amount of flare occurring through a mask at EUV exposure; a step of providing a dummy mask pattern on the mask based on the evaluated result of the amount of flare; and a step of executing a flare correction and an optical proximity correction on a layout pattern. The layout pattern is provided by the EUV exposure through the mask with the dummy mask pattern.
申请公布号 US9268208(B2) 申请公布日期 2016.02.23
申请号 US201213421688 申请日期 2012.03.15
申请人 Kabushiki Kaisha Toshiba 发明人 Aburada Ryota;Mashita Hiromitsu;Uno Taiga;Miyairi Masahiro;Kotani Toshiya
分类号 G03B27/42;G03B27/54;G03B27/68;G03F1/36;G03F7/20;G03F1/70 主分类号 G03B27/42
代理机构 Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. 代理人 Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
主权项 1. A pattern generating method comprising: evaluating an amount of flare occurring through a mask at EUV exposure, the mask having a main mask pattern; providing a dummy mask pattern on the mask based on the evaluated result of the amount of flare; executing a flare correction and an optical proximity correction on a layout pattern formed by the EUV exposure through the mask with the dummy mask pattern; and executing a bias process on the main mask pattern of the mask to thicken a line width of the main mask pattern by an amount of line width that is to be removed by a slimming process that removes a dummy layout pattern on a wafer formed corresponding to the dummy mask pattern.
地址 Tokyo JP
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