| 发明名称 |
armação guia para componentes eletrônicos |
| 摘要 |
The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe. |
| 申请公布号 |
BRPI0920322(A2) |
申请公布日期 |
2016.02.23 |
| 申请号 |
BR2009PI20322 |
申请日期 |
2009.10.12 |
| 申请人 |
TYCO ELECTRONICS AMP GMBH |
发明人 |
FRIEDRICH SEGER;JOACHIM STIFTER;JOSEF SINDER;OLIVER WERNER;PETER GOESELE |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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