发明名称 High quality factor inductive and capacitive circuit structure
摘要 A circuit includes a first finger capacitor having a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements. The first bus line is parallel to the second bus line. The circuit further includes an inductor having a first leg oriented perpendicular to the first bus line and the second bus line. The first leg of the inductor is coupled to a center of the first bus line.
申请公布号 US9270247(B2) 申请公布日期 2016.02.23
申请号 US201314092241 申请日期 2013.11.27
申请人 XILINX, INC. 发明人 Jing Jing;Wu Shuxian;Wu Zhaoyin D.
分类号 H03H7/01;H01L23/522;H01L27/01;H01L49/02;H05K1/16;H03H5/02 主分类号 H03H7/01
代理机构 代理人 Cuenot Kevin T.;King John J.
主权项 1. A circuit, comprising: a first finger capacitor comprising a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements; wherein the first bus line is parallel to the second bus line; an inductor comprising a first leg oriented perpendicular to the first bus line and the second bus line; wherein the first leg is implemented in a conductive layer above the first finger capacitor; and a first via structure coupled between the first leg and the first bus line; wherein the first leg of the inductor bisects the first finger capacitor and is coupled to a center of the first bus line by the first via structure; and wherein the first via structure is disposed symmetrically about a line at the center of the first bus line that is perpendicular to the first bus line.
地址 San Jose CA US