发明名称 |
High quality factor inductive and capacitive circuit structure |
摘要 |
A circuit includes a first finger capacitor having a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements. The first bus line is parallel to the second bus line. The circuit further includes an inductor having a first leg oriented perpendicular to the first bus line and the second bus line. The first leg of the inductor is coupled to a center of the first bus line. |
申请公布号 |
US9270247(B2) |
申请公布日期 |
2016.02.23 |
申请号 |
US201314092241 |
申请日期 |
2013.11.27 |
申请人 |
XILINX, INC. |
发明人 |
Jing Jing;Wu Shuxian;Wu Zhaoyin D. |
分类号 |
H03H7/01;H01L23/522;H01L27/01;H01L49/02;H05K1/16;H03H5/02 |
主分类号 |
H03H7/01 |
代理机构 |
|
代理人 |
Cuenot Kevin T.;King John J. |
主权项 |
1. A circuit, comprising:
a first finger capacitor comprising a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements; wherein the first bus line is parallel to the second bus line; an inductor comprising a first leg oriented perpendicular to the first bus line and the second bus line; wherein the first leg is implemented in a conductive layer above the first finger capacitor; and a first via structure coupled between the first leg and the first bus line; wherein the first leg of the inductor bisects the first finger capacitor and is coupled to a center of the first bus line by the first via structure; and wherein the first via structure is disposed symmetrically about a line at the center of the first bus line that is perpendicular to the first bus line. |
地址 |
San Jose CA US |