Vertically integrated systems

摘要

Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

主权项

1. An integrated circuit system comprising:
an active layer of a semiconductor die, the active layer comprising an active circuit; a measuring layer integrated with the active layer, the measuring layer comprising a sensing element, and the measuring layer configured to generate an electrical signal indicative of a property of a fluid using the sensing element; a conduit configured to provide the fluid from external to the integrated circuit system to the sensing element, wherein the conduit comprises a structure configured to manipulate the flow of the fluid; and a conductive path configured to provide an electrical connection between the measuring layer and the active circuit.