发明名称 Light-emitting diode bulb with loudspeaker function
摘要 A light-emitting diode bulb with loudspeaker function includes a bulb head, a drive power assembly, a heat radiator, a light-emitting diode module, a loudspeaker assembly, and a cover covered on the heat radiator. The drive power assembly is assembled to an upper portion of the bulb head, and is electrically connected with the bulb head. The drive power assembly includes a power supply circuit board assembly and a wireless module. The heat radiator is mounted to the upper portion of the bulb head. The drive power assembly is received in the heat radiator. The light-emitting diode module is mounted on the heat radiator, and is electrically connected with the power supply circuit board assembly. The loudspeaker assembly mounted on the light-emitting diode module, the heat radiator and the drive power assembly includes a fastening holder, an audio circuit board, a fastening bracket and a speaker unit.
申请公布号 US9267675(B2) 申请公布日期 2016.02.23
申请号 US201414329852 申请日期 2014.07.11
申请人 WELL SHIN TECHNOLOGY CO., LTD. 发明人 Wu Jui Hsiung
分类号 H04R1/02;H04R3/12;F21V33/00;F21V29/83;F21V23/06;F21V23/00;F21Y101/02 主分类号 H04R1/02
代理机构 Lin & Associates Intellectual Property, Inc. 代理人 Lin & Associates Intellectual Property, Inc.
主权项 1. A light-emitting diode bulb with loudspeaker function, comprising: a bulb head; a drive power assembly assembled to an upper portion of the bulb head, and electrically connected with the bulb head, the drive power assembly including a power supply circuit board assembly, and a wireless module disposed to a top end of the power supply circuit board assembly; a heat radiator mounted to the upper portion of the bulb head, the drive power assembly being received in the heat radiator; a light-emitting diode module mounted on the heat radiator, and electrically connected with the power supply circuit board assembly of the drive power assembly; a loudspeaker assembly mounted on the light-emitting diode module, the heat radiator and the drive power assembly, the loudspeaker assembly including a fastening holder mounted on the light-emitting diode module, the heat radiator and the drive power assembly, an audio circuit board disposed to the fastening holder and electrically connected with the power supply circuit board assembly, a fastening bracket mounted on the audio circuit board, the fastening holder, the light-emitting diode module and the heat radiator, and a speaker unit fastened to the fastening bracket and electrically connected with the audio circuit board which has a main board, a Bluetooth integrated circuit chip disposed on the main board, and a power amplifier chip disposed on the main board; and a cover covered on the heat radiator to locate the light-emitting diode module and the loudspeaker assembly between the cover and the heat radiator, a top of the cover defining a plurality of through-holes.
地址 Taipei TW