| 发明名称 | Narrow-gap flip chip underfill composition | ||
| 摘要 | An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles. | ||
| 申请公布号 | US9269596(B2) | 申请公布日期 | 2016.02.23 |
| 申请号 | US201314135236 | 申请日期 | 2013.12.19 |
| 申请人 | Intel Corporation | 发明人 | Xiu Yonghao;Ananthakrishnan Nisha;Bai Yiqun;Krishnan Arjun |
| 分类号 | H01L23/29;H01L21/56;H01L23/00 | 主分类号 | H01L23/29 |
| 代理机构 | Schwegman Lundberg & Woessner, P.A. | 代理人 | Schwegman Lundberg & Woessner, P.A. |
| 主权项 | 1. An underfill composition comprising: a curable resin; a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition, the filler particles comprising: first filler particles having a particle size of from 0.1 micrometers to 15 micrometers; andsecond filler particles having a particle size of less than 100 nanometers, wherein a loading of the second filler particles in the underfill composition is below or proximate to a cutoff threshold where the viscosity of the underfill composition begins to increase;wherein a viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles. | ||
| 地址 | Santa Clara CA US | ||