| 发明名称 | Device mounting board, semiconductor module, and method for fabricating the device mounting board | ||
| 摘要 | A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device. | ||
| 申请公布号 | US9271389(B2) | 申请公布日期 | 2016.02.23 |
| 申请号 | US201314089523 | 申请日期 | 2013.11.25 |
| 申请人 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. | 发明人 | Kohara Yasuhiro;Nagamatsu Masayuki;Deguchi Koutaro |
| 分类号 | H05K1/03;H05K1/02;H01L23/14;H05K3/00;H01L23/498;H01L23/00;H01L25/065;H01L25/18;H01L33/64 | 主分类号 | H05K1/03 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A device mounting board comprising: a metallic substrate; an oxide film formed such that surfaces of the metallic substrate are oxidized; an insulating resin layer provided on the oxide film that faces one main surface of the metallic substrate; and a wiring layer provided on the insulating resin layer, wherein the thickness of at least part of the oxide film is greater than that of the other parts of the oxide film. | ||
| 地址 | Osaka JP | ||