发明名称 Tunneling devices and methods of manufacturing the same
摘要 A tunneling device may include a tunnel barrier layer, a first material layer including a first conductivity type two-dimensional material on a first surface of the tunnel barrier layer and a second material layer including a second conductivity type two-dimensional material on a second surface of the tunnel barrier layer. The tunneling device may use a tunneling current through the tunnel barrier layer between the first material layer and the second material layer.
申请公布号 US9269775(B2) 申请公布日期 2016.02.23
申请号 US201414188862 申请日期 2014.02.25
申请人 SAMSUNG ELECTRONICS CO., LTD.;SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION 发明人 Choi Jun-hee;Yoo Won-jong;Lee Seung-hwan;Choi Min-sup;Liu Xiao Chi;Lee Ji-a
分类号 H01L29/737;H01L29/16;H01L29/73;H01L29/66;H01L29/88 主分类号 H01L29/737
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A tunneling device comprising: a tunnel barrier layer; a first material layer on a first surface of the tunnel barrier layer, the first material layer including a P-type two-dimensional (2D) material; and a second material layer on a second surface of the tunnel barrier layer, the second material layer including an N-type 2D material, wherein the tunneling device uses a tunneling current through the tunnel barrier layer between the first material layer and the second material layer, and wherein the first material layer has a work function of about 5.0 eV to about 5.9 eV, and the second material layer has a work function of about 3.2 eV to about 4.0 eV.
地址 Gyeonggi-Do KR