发明名称 |
Tunneling devices and methods of manufacturing the same |
摘要 |
A tunneling device may include a tunnel barrier layer, a first material layer including a first conductivity type two-dimensional material on a first surface of the tunnel barrier layer and a second material layer including a second conductivity type two-dimensional material on a second surface of the tunnel barrier layer. The tunneling device may use a tunneling current through the tunnel barrier layer between the first material layer and the second material layer. |
申请公布号 |
US9269775(B2) |
申请公布日期 |
2016.02.23 |
申请号 |
US201414188862 |
申请日期 |
2014.02.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION |
发明人 |
Choi Jun-hee;Yoo Won-jong;Lee Seung-hwan;Choi Min-sup;Liu Xiao Chi;Lee Ji-a |
分类号 |
H01L29/737;H01L29/16;H01L29/73;H01L29/66;H01L29/88 |
主分类号 |
H01L29/737 |
代理机构 |
Harness, Dickey & Pierce, P.L.C. |
代理人 |
Harness, Dickey & Pierce, P.L.C. |
主权项 |
1. A tunneling device comprising:
a tunnel barrier layer; a first material layer on a first surface of the tunnel barrier layer, the first material layer including a P-type two-dimensional (2D) material; and a second material layer on a second surface of the tunnel barrier layer, the second material layer including an N-type 2D material, wherein the tunneling device uses a tunneling current through the tunnel barrier layer between the first material layer and the second material layer, and wherein the first material layer has a work function of about 5.0 eV to about 5.9 eV, and the second material layer has a work function of about 3.2 eV to about 4.0 eV. |
地址 |
Gyeonggi-Do KR |