| 发明名称 | Semiconductor package having heat dissipating member | ||
| 摘要 | A semiconductor package includes a substrate having an upper surface and a lower surface, a semiconductor chip which is mounted on the upper surface of the substrate, and in an upper surface of which a first recess portion is provided, a molding member formed such that the molding member exposes the upper surface of the semiconductor chip and covers the semiconductor chip on the upper surface of the substrate, and a first heat dissipating member formed in the first recess portion, wherein the first heat dissipating member includes moisture absorption particles and a heat dissipation molding member. | ||
| 申请公布号 | US9269647(B2) | 申请公布日期 | 2016.02.23 |
| 申请号 | US201514723834 | 申请日期 | 2015.05.28 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Du Maohua |
| 分类号 | H01L23/34;H01L21/00;H01L23/367;H01L23/00;H01L23/31;H01L23/373;H01L23/29;H01L25/065;H01L23/42;H01L21/56;H01L23/498 | 主分类号 | H01L23/34 |
| 代理机构 | Harness, Dickey & Pierce, PLC | 代理人 | Harness, Dickey & Pierce, PLC |
| 主权项 | 1. A semiconductor package comprising: a substrate having an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the substrate, the semiconductor chip including an upper surface, and the upper surface including a first recess portion; a molding member that exposes the upper surface of the semiconductor chip and is disposed between the semiconductor chip and the upper surface of the substrate; and a first heat dissipating member formed in the first recess portion, wherein the first heat dissipating member comprises at least one moisture absorption particle and a heat dissipation molding member. | ||
| 地址 | Gyeonggi-Do KR | ||