发明名称 Composition for forming resist underlayer film, and pattern-forming method
摘要 A composition for forming a resist underlayer film includes a polysiloxane, and a solvent composition. The solvent composition includes an organic solvent which includes a compound represented by the following formula (1) or a carbonate compound and which has a standard boiling point of no less than 150.0° C. R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms. R3 represents a hydrogen atom or a methyl group. n is an integer of 1 to 4. In a case where n is no less than 2, a plurality of R3s are identical or different.;
申请公布号 US9268229(B2) 申请公布日期 2016.02.23
申请号 US201313853131 申请日期 2013.03.29
申请人 JSR CORPORATION 发明人 Tanaka Hiromitsu;Suzuki Junya;Motonari Masayuki;Kimura Tooru
分类号 G03F7/09;G03F7/004;G03F7/075;H01L21/312 主分类号 G03F7/09
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A composition for forming a resist underlayer film,comprising: a polysiloxane; an acid diffusion control agent capable of inhibiting diffustion of an acid; and a solvent composition capable of dissolving the polysiloxane, the solvent composition comprising: an organic solvent which comprises a compound represented by formula (1) or a carbonate compound and which has a standard boiling point of no less than 150.0° C., includes a compound wherein, in the formula (1), R1 and R2 each independently represent an alkyl group having 1 to 4 carbon atoms or an acyl group having 1 to 4 carbon atoms; R3 represents a hydrogen atom or a methyl group; n is an integer of 1 to 4, in a case where n is no less than 2, a plurality of R3s are identical or different; a content of the organic solvent in the solvent composition is no less than 1% by mass and no greater than 50% by mass; and wherein the solvent composition further comprises an alkylene glycol monoalkyl ether acetate compound having a standard boiling point of less than 150.0° C., a content of no less than 50% by mass and no greater than 99% by mass.
地址 Tokyo JP