发明名称 Polishing method and polishing apparatus
摘要 A method of polishing a substrate is disclosed. The method includes irradiating the substrate with light; measuring intensity of the reflected light; producing spectral waveform representing relationship between relative reflectance and wavelength of the light; performing a Fourier transform process on the spectral waveform to determine a thickness of the film and a corresponding strength of frequency component; determining whether the determined thickness of the film is reliable or not by comparing the strength of frequency component with a threshold value; calculating a defective data rate representing a proportion of the number of unreliable measured values to the total number of measured values; and changing the threshold value based on the defective data rate.
申请公布号 US9266214(B2) 申请公布日期 2016.02.23
申请号 US201414260229 申请日期 2014.04.23
申请人 Ebara Corporation 发明人 Kimba Toshifumi
分类号 B24B37/00;B24B37/013;B24B49/12;H01L21/306 主分类号 B24B37/00
代理机构 Baker & Hostetler LLP 代理人 Baker & Hostetler LLP
主权项 1. A method of polishing a substrate having a film, the method comprising: polishing the substrate by pressing the substrate against a polishing tool on a rotating polishing table; irradiating the substrate with light when polishing the substrate; receiving the light reflected from the substrate; measuring intensity of the reflected light at respective wavelengths; calculating relative reflectance by dividing the measured intensity of the light by predetermined reference intensity; producing spectral waveform representing relationship between the relative reflectance and wavelength of the light; performing a Fourier transform process on the spectral waveform to determine a thickness of the film and a corresponding strength of frequency component; determining that the determined thickness of the film is a reliable measured value if the strength of frequency component is higher than a predetermined threshold value; determining that the determined thickness of the film is an unreliable measured value if the strength of frequency component is equal to or lower than the predetermined threshold value; determining a polishing end point of the substrate based on a point of time when the reliable measured value has reached a predetermined target value; calculating a defective data rate representing a proportion of the number of unreliable measured values to the total number of reliable measured values and unreliable measured values that have been obtained previously; and changing the predetermined threshold value based on the defective data rate.
地址 Tokyo JP