Chip package and method of manufacturing the same

摘要

A chip package includes semiconductor chips, inner spacers, cavities, conductive portions and solder balls. The semiconductor chip has at least an electronic component and at least an electrically conductive pad disposed on an upper surface thereof. The conductive pad is arranged abreast to one side of the electronic component and electrically connected thereto. The cavities open to a lower surface of the semiconductor chip and extend toward the upper surface to expose the conductive pad on the upper surface. The conductive portions fill the cavities from the lower surface and electrically connected the to conductive pad. The solder balls are disposed on the lower surface and electrically connected to the conductive portions. A gap is created between an outer wall of the inner spacers and an edge of the semiconductor chip.

主权项

1. A chip package, comprising:
a semiconductor chip having at least an electronic component and at least an electrically conductive pad disposed on an upper surface of the semiconductor chip, the conductive pad arranged abreast to one side of the electronic component and electrically connected to the electronic component; an inner spacer disposed on the upper surface and surrounding the electronic component; a cavity opening on a lower surface of the semiconductor and exposing the conductive pad that is disposed on the upper surface; a conductive portion filling the cavity and electrically connected to the conductive pad; and a solder ball disposed on the lower surface and electrically connected to the conductive portion, wherein a gap is created between one side of the inner spacer and an edge of the semiconductor chip.