Optoelectronic chip-on-board module

摘要

A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.

主权项

1. An optoelectronic chip-on-board module comprising;
a flat substrate having a surface populated with an array of optoelectronic components; and a transparent, UV-resistant, and temperature-resistant coating made of a silicone,
wherein in a completed configuration of the module after all steps for producing the module have been completed, the surface of the substrate populated with the array of optoelectronic components is coated with the silicone without a margin and first and second lateral surfaces of the substrate are entirely coated with the silicone, such that the coating forms a lens array that entirely covers the array of optoelectronic components with one lens covering each optoelectronic component.