Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods

摘要

Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a stack of semiconductor dies and a thermally conductive casing at least partially enclosing the stack of semiconductor dies within an enclosure. A package substrate carries the thermally conductive casing, and an interposer is disposed between the thermally conductive casing and the stack of semiconductor dies. A peripheral portion of the interposer extends laterally beyond the stack of semiconductor dies and is coupled to a plurality of conductive members interposed between the peripheral portion and the package substrate.

主权项

1. A semiconductor die assembly, comprising:
a stack of semiconductor dies having a vertical height; a thermally conductive casing; an interposer between the thermally conductive casing and the stack of semiconductor dies, wherein a peripheral portion of the interposer extends laterally beyond the stack of semiconductor dies; a package substrate carrying the thermally conductive casing; and a plurality of conductive members interposed between the package substrate and the peripheral portion of the interposer, wherein each of the conductive members includes a solder bump having a vertical height that is about equal to or greater than the vertical height of the stack of semiconductor dies.