Semiconductor device with a connection pad in a substrate and method for production thereof

摘要

A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.

主权项

1. A semiconductor device comprising:
a first semiconductor substrate; a first pad formed on the first semiconductor substrate; a second semiconductor substrate; and a second pad formed on the second semiconductor substrate, wherein a size of the second pad is larger than a size of the first pad, wherein the first pad is in contact with a layer formed of a material at least partially covering a surface of the second pad, and wherein a surface of the first pad in contact with the layer formed of the material at least partially covering the surface of the second pad is positioned to face the second pad.