Method of making flexible, foldable, and stretchable devices

摘要

A method of making a flexible, foldable, stretchable electronic device. The method includes deposition of a polymer layer, such as parylene C, to impart flexibility to the device. The device overcomes the limitations of related flexible electronics schemes by employing established silicon-on-insulator complementary metal-oxide-semiconductor technology with a flexible enclosure. Devices made in such a way may be used in a wide variety of applications including incorporation into medical devices.

主权项

1. A method of making a flexible device comprising:
providing a silicon-on-insulator wafer comprising a device layer having at least one silicon island and at least one metal trace, the device layer being posited on a buried oxide layer, the buried oxide layer being posited on a silicon substrate layer; depositing a first polymer layer over the silicon-on-insulator wafer, the first polymer layer being above and in contact with the at least one silicon island and the at least one metal trace; forming at least one etching windows through the first polymer layer, the device layer, and the buried oxide layer; using an etchant through the at least one etching window to degrade the silicon substrate layer; depositing a second polymer layer to seal the at least one etching window and conformally over the silicon substrate layer and the silicon-on-insulator wafer; and removing the silicon substrate layer.