Independent control of stacked electronic modules

摘要

Various embodiments of apparatuses are disclosed to allow independent control of stacked modules. In one embodiment, an apparatus may include a plurality of stacked memory dice, with at least some of the plurality of stacked memory dice include a Chip Enable (CE) signal connection electrically accessible from a surface of a corresponding one of the dice. Each of the stacked dice having the CE signal connection is controllable individually by a unique CE signal applied to the CE signal connection. Other apparatuses are disclosed.

主权项

1. An apparatus, comprising:
a plurality of modules, at least some of the plurality of modules including a plurality of stacked dice, each of the plurality of stacked dice including a Chip Enable (CE) signal connection electrically accessible from a surface of a corresponding one of the plurality of modules; and a Package-on-Package (PoP) structure coupling the plurality of modules to one another such that an individual access to each CE signal connection associated with the PoP structure is provided from the surface of the corresponding module.