发明名称 |
Fan-out wafer level package |
摘要 |
A fan-out wafer level package is provided. The fan-out wafer level package includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. The semiconductor element includes a plurality of bonding pads. The molding compound covers the semiconductor element. The first fan-out structure is formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads. The conductive heat spreader is formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material. The solder balls are formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material. |
申请公布号 |
US9269645(B1) |
申请公布日期 |
2016.02.23 |
申请号 |
US201414521893 |
申请日期 |
2014.10.23 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Lin Chu-Fu;Kuo Chien-Li;Chen Kuo-Ming |
分类号 |
H01L23/40;H01L23/34;H01L23/522;H01L23/00 |
主分类号 |
H01L23/40 |
代理机构 |
WPAT, PC |
代理人 |
WPAT, PC ;King Justin |
主权项 |
1. A fan-out wafer level package, comprising:
a semiconductor element comprising a plurality of bonding pads; a molding compound covering the semiconductor element; a first fan-out structure formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads; a conductive heat spreader formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material; and a plurality of solder balls formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material. |
地址 |
Hsinchu TW |