发明名称 |
Integrated circuit device methods and models with predicted device metric variations |
摘要 |
A method can include selecting integrated circuit (IC) device fabrication process source variations; generating relationships between each process source variance and a device metric variance; and calculating at least one IC device metric value from the process source variations and corresponding relationships between each process source variance and a device metric variance. |
申请公布号 |
US9268885(B1) |
申请公布日期 |
2016.02.23 |
申请号 |
US201313780006 |
申请日期 |
2013.02.28 |
申请人 |
Mie Fujitsu Semiconductor Limited |
发明人 |
Wang Jing |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
Baker Botts L.L.P. |
代理人 |
Baker Botts L.L.P. |
主权项 |
1. A method, comprising:
assuming variation among process targets for a plurality of integrated circuit (IC) fabrication process sources of variation; deriving relationships between each process source variance of the IC fabrication process and a device metric variance by operation of a computer program executed by a computer, the device metric variance being a variance in an IC performance characteristic; generating a predicted device metric variation by at least multiplying each process source variation by the corresponding relationships between its process source variance and the device metric variance; and designing at least a portion of an integrated circuit with the predicted device metric variation; wherein. generating the predicted device metric variation includes calculating a root sum square of process source variations and the relationships between the corresponding process source variance and the device metric variance; designing the at least a portion of the integrated circuit includes selecting process source variations having a greatest effect on the predicted device metric variation and creating a transistor performance model from at least the device metric; and fabricating the at least a portion of the integrated circuit with the predicted device metric variation. |
地址 |
Kuwana, Mie JP |