Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer

摘要

The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.

主权项

1. A stripline assembly comprising:
a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate; a second pre-fired ceramic substrate including a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface, the circuit being disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate; and a conductive bonding layer disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate, wherein said conductive bonding layer is formed from more than one metallic bonding layer.