发明名称 Manufacturing method of semiconductor device
摘要 A semiconductor device using an oxide semiconductor is provided with stable electric characteristics to improve the reliability. In a manufacturing process of a transistor including an oxide semiconductor film, an oxide semiconductor film containing a crystal having a c-axis which is substantially perpendicular to a top surface thereof (also called a first crystalline oxide semiconductor film) is formed; oxygen is added to the oxide semiconductor film to amorphize at least part of the oxide semiconductor film, so that an amorphous oxide semiconductor film containing an excess of oxygen is formed; an aluminum oxide film is formed over the amorphous oxide semiconductor film; and heat treatment is performed thereon to crystallize at least part of the amorphous oxide semiconductor film, so that an oxide semiconductor film containing a crystal having a c-axis which is substantially perpendicular to a top surface thereof (also called a second crystalline oxide semiconductor film) is formed.
申请公布号 US9269797(B2) 申请公布日期 2016.02.23
申请号 US201514632081 申请日期 2015.02.26
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 Koezuka Junichi;Yamade Naoto;Sato Yuhei;Okazaki Yutaka;Yamazaki Shunpei
分类号 H01L21/00;H01L21/20;H01L21/36;H01L29/66;H01L29/786;H01L21/383;H01L21/44;H01L21/477 主分类号 H01L21/00
代理机构 Robinson Intellectual Property Law Office 代理人 Robinson Intellectual Property Law Office ;Robinson Eric J.
主权项 1. A method for manufacturing a semiconductor device, comprising the steps of: forming an oxide semiconductor film over an insulating film; forming a gate insulating film over the oxide semiconductor film; forming a gate electrode layer over the gate insulating film; adding oxygen to the oxide semiconductor film after forming the gate electrode layer.
地址 Kanagawa-ken JP