发明名称 Semiconductor device
摘要 A semiconductor device, comprising: a first semiconductor layer disposed on a substrate; a second semiconductor layer disposed on the first semiconductor layer; a lower insulating film disposed on the second semiconductor layer; a p-type electroconductive oxide film disposed on the lower insulating film; an upper insulating film disposed on the oxide film; and a gate electrode disposed on the upper insulating film, wherein the lower insulating film under the gate electrode has a depressed portion.
申请公布号 US9269782(B2) 申请公布日期 2016.02.23
申请号 US201213606542 申请日期 2012.09.07
申请人 FUJITSU LIMITED 发明人 Kanamura Masahito;Miyajima Toyoo;Ohki Toshihiro
分类号 H01L29/423;H01L29/66;H01L29/778;H01L29/20;H03F1/32;H01L21/28 主分类号 H01L29/423
代理机构 Kratz, Quintos & Hanson, LLP 代理人 Kratz, Quintos & Hanson, LLP
主权项 1. A semiconductor device, comprising: a first semiconductor layer formed over a substrate; a second semiconductor layer formed over the first semiconductor layer; a source electrode and a drain electrode formed over the second semiconductor layer; a lower insulating film formed over the second semiconductor layer between the source electrode and the drain electrode; a recess formed in the lower insulating film; a p-type electroconductive oxide film formed over the lower insulating film; an upper insulating film formed over the p-type electroconductive oxide film between the source electrode and the drain electrode; the upper insulating film is in contact with the source electrode and the drain electrode; and a gate electrode formed on the upper insulating film, wherein the recess in the lower insulating film is formed under a region where the gate electrode is formed.
地址 Kawasaki JP