发明名称 |
Semiconductor device |
摘要 |
A semiconductor device, comprising: a first semiconductor layer disposed on a substrate; a second semiconductor layer disposed on the first semiconductor layer; a lower insulating film disposed on the second semiconductor layer; a p-type electroconductive oxide film disposed on the lower insulating film; an upper insulating film disposed on the oxide film; and a gate electrode disposed on the upper insulating film, wherein the lower insulating film under the gate electrode has a depressed portion. |
申请公布号 |
US9269782(B2) |
申请公布日期 |
2016.02.23 |
申请号 |
US201213606542 |
申请日期 |
2012.09.07 |
申请人 |
FUJITSU LIMITED |
发明人 |
Kanamura Masahito;Miyajima Toyoo;Ohki Toshihiro |
分类号 |
H01L29/423;H01L29/66;H01L29/778;H01L29/20;H03F1/32;H01L21/28 |
主分类号 |
H01L29/423 |
代理机构 |
Kratz, Quintos & Hanson, LLP |
代理人 |
Kratz, Quintos & Hanson, LLP |
主权项 |
1. A semiconductor device, comprising:
a first semiconductor layer formed over a substrate; a second semiconductor layer formed over the first semiconductor layer; a source electrode and a drain electrode formed over the second semiconductor layer; a lower insulating film formed over the second semiconductor layer between the source electrode and the drain electrode; a recess formed in the lower insulating film; a p-type electroconductive oxide film formed over the lower insulating film; an upper insulating film formed over the p-type electroconductive oxide film between the source electrode and the drain electrode; the upper insulating film is in contact with the source electrode and the drain electrode; and a gate electrode formed on the upper insulating film, wherein the recess in the lower insulating film is formed under a region where the gate electrode is formed. |
地址 |
Kawasaki JP |