High efficiency module

摘要

A module (1) includes a first functional device (2) and a second functional device (3). The first functional device (2) includes a base electrode, an emitter electrode and a collector electrode. The second functional device (3) includes at least one electrode. The module (1) further includes a conductive frame (4). One of the base electrode, the emitter electrode, and the collector electrode of the first functional device (2) is directly connected to the frame (4). The electrode of the second functional device (3) is also directly connected to the frame (4). The frame (4) includes a portion serving as a terminal for external connection.

主权项

1. A module, comprising:
a first functional device comprising a first control electrode, and a first pair of main electrodes; a second functional device disposed above the first functional device, the second functional device comprising a second control electrode, and a second pair of main electrodes; a first frame comprising a first portion disposed above the first functional device; a second frame comprising a second portion disposed between the first functional device and the second functional device, wherein one of the first pair of main electrodes of the first functional device and one of the second pair of main electrodes of the second functional device are each directly connected to the second frame; a third frame comprising a third portion disposed below the second functional device; and a resin package covering the first functional device, the second functional device, the first portion of the first frame, the second portion of the second frame, and the third portion of the third frame, the resin package comprising a mounting surface for being soldered to a circuit board, the third frame further comprising an exposed surface exposed from the mounting surface of the resin package, and the exposed surface of the third frame, the first functional device, and the second functional device are arranged in a normal direction perpendicular to the mounting surface of the resin package.