Temporary liquid thermal interface material for surface tension adhesion and thermal control

摘要

An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.

主权项

1. A method of testing a three-dimensional device, comprising:
temporarily adhering a wafer to a glass substrate with an adhesive; thinning the wafer to form a thinned wafer; and temporarily attaching the thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the carrier wafer together, wherein the non-adhesive material is applied after the adhesive material, wherein the thinned wafer is detached from the glass substrate prior to temporarily attaching the thinned wafer to the carrier wafer, and wherein the carrier wafer is an unprocessed silicon wafer, wherein the thinning the wafer to form the thinned wafer forms a through silicon via (TSV) in the thinned wafer, and further comprising:
testing the thinned wafer by contacting the TSV while the thinned wafer is attached to the carrier wafer;dicing the thinned wafer while the thinned wafer is attached to the carrier wafer and without dicing the carrier wafer, wherein the dicing forms diced dies;releasing the diced dies from the carrier wafer using a bake procedure that evaporates the non-adhesive material;picking the diced dies from the carrier wafer; andremoving the adhesive material the diced dies.