| 发明名称 | Ultrathin flip-chip packaging techniques and configurations | ||
| 摘要 | Embodiments include but are not limited to apparatuses and systems including microelectronic devices including a package substrate, a plurality of electronic components disposed on and electrically coupled with the package substrate at one or more sides of the package substrate, one or more hollow cavity sheet molds surrounding the plurality of electronic components and coupled with one or more sides of the package substrate, and a plurality of through-mold vias to couple the package substrate with an external surface of at least one of the one or more hollow cavity sheet molds. The microelectronic device may be a chip-scale package or module. Methods and systems for making the same also are described. | ||
| 申请公布号 | US9269887(B1) | 申请公布日期 | 2016.02.23 |
| 申请号 | US201514619927 | 申请日期 | 2015.02.11 |
| 申请人 | TriQuint Semiconductor, Inc. | 发明人 | Juskey Frank J.;Hartmann Robert C.;Morris Thomas S.;Glascock Howard T.;Ordonez Jose F. |
| 分类号 | H01L23/31;H01L41/311;H01L41/053;H01L41/08;H01L41/25;H01L25/16;H01L23/36;H01L23/538 | 主分类号 | H01L23/31 |
| 代理机构 | Withrow & Terranova, P.L.L.C. | 代理人 | Withrow & Terranova, P.L.L.C. |
| 主权项 | 1. An apparatus comprising: a package substrate; a plurality of electronic components disposed on and electrically coupled with the package substrate at one or more sides of the package substrate; one or more hollow cavity sheet molds surrounding the plurality of electronic components and coupled with one or more sides of the package substrate; and a plurality of through-mold vias to couple the package substrate with an external surface of at least one of the one or more hollow cavity sheet molds. | ||
| 地址 | Hillsboro OR US | ||