Methods of forming imaging device layers using carrier substrates

摘要

An array of color filter elements may be formed over an array of photodiodes in an integrated circuit for an imaging device using a carrier substrate. The carrier substrate may have a planar surface with a release layer. A layer of color filter material may be applied to the release layer. The carrier substrate may then be flipped and the layer of color filter material may be bonded to the integrated circuit. Heat may be applied to activate the release layer and the carrier substrate may be removed at the interface between the release layer and the color filter material. The layer of color filter material may be patterned either before bonding the layer of color filter material or after the carrier substrate is removed. A layer of microlenses may be formed over the array of color filter elements using a carrier substrate.

主权项

1. A method of forming an array of color filter elements over an imaging device integrated circuit including an array of photodiodes in an imaging device, comprising:
depositing a layer of color filter material on a planar surface of a carrier substrate; bonding the layer of color filter material to the imaging device integrated circuit; while the layer of color filter material is bonded to the imaging device integrated circuit, removing the carrier substrate from the layer of color filter material; and after removing the carrier substrate from the layer of color filter material, patterning the layer of color filter material to form the array of color filter elements on the integrated circuit.