发明名称 Forming conductive metal pattern using reactive polymers
摘要 A conductive metal pattern is formed in a polymeric layer that has a reactive polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure to radiation, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking. The polymeric layer is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising pendant sulfonic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. The electroless seed metal ions are reduced to provide a pattern of electroless seed metal nuclei that are then electrolessly plated with a conductive metal.
申请公布号 US9268223(B2) 申请公布日期 2016.02.23
申请号 US201314084693 申请日期 2013.11.20
申请人 EASTMAN KODAK COMPANY 发明人 Irving Mark Edward;Wexler Allan;Bennett Grace Ann;Lindner Kimberly S.
分类号 G03F7/26;G03F7/038;C23C18/16;C23C18/20;C23C18/18;G03F7/004 主分类号 G03F7/26
代理机构 代理人 Tucker J. Lanny
主权项 1. A method for providing a pattern in a polymeric layer, the method comprising: providing a polymeric layer comprising a reactive composition that comprises a reactive polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure of the reactive polymer to radiation having a λmax of at least 150 mn and up to and including 450 nm, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking in the reactive polymer, patternwise exposing the polymeric layer to radiation having a λmax of at least 150 nm and up to and including 450 nm, to provide a polymeric layer comprising non-exposed regions and exposed regions, and to provide a polymer comprising pendant sulfonic acid groups only in the exposed regions, contacting the exposed regions of the polymeric layer with electroless seed metal ions to form a pattern of electroless seed metal ions in the exposed regions of the polymeric layer, reducing the pattern of electroless seed metal ions to provide a pattern of corresponding electroless seed metal nuclei in the exposed regions of the polymeric layer, electrolessly plating the corresponding electroless seed metal nuclei in the exposed regions of the polymeric layer with a metal that is the same as or different from the corresponding electroless seed metal nuclei, and at any time after patternwise exposing the polymeric layer to radiation, removing the reactive composition in the non-exposed regions of the polymeric layer.
地址 Rochester NY US
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