| 摘要 |
The present invention relates to a wafer polishing apparatus which collects used slurry without having a pollutant introduced thereto to reuse the slurry. The wafer polishing apparatus includes a lower plate which is rotatably installed; an upper plate which moves up and down and rotates as installed in the upper part of the lower plate, and is geared with the lower plate to rotate in opposite directions to each other; a slurry supply part which supplies slurry from the upper plate to a polishing pad; a drain which is formed on a lower side of the lower plate and collects washing water with which the polish pad has been washed; and a slurry collection part which is separated from an outer circumference and the lower part of the lower plate by a predetermined distance and surrounds the the outer circumference and the lower part, and has a hole for collecting slurry. |
