METHOD AND DEVICE FOR DIVIDING BRITTLE MATERIAL SUBSTRATE

摘要

Provided is a dividing method which can divide a scribed substrate into chips without generating splinters from edges of the chips. An adhesive film (42) is attached to a ring member (41) and the adhesive film (41) is pressurized onto a surface where a scribe line of a brittle material substrate (40) is formed to support a ring member (41). A protective film (43) is covered on one surface of the brittle material substrate (40), the brittle material substrate (40) is supported between bed knives to locate the scribe line in the center of the brittle material substrate, and a brake bar (23) is pressed along the scribe line from an upper surface of the protective film (43).