| 摘要 |
A semiconductor package comprises: a substrate including connection pads; a first semiconductor chip; and conductive wires. The first semiconductor chip is stacked on the substrate and comprises bonding pads, non-bonding pads, and a routing area which is installed in a central portion of one side of the first semiconductor chip. The conductive wires are connected to the bonding pads and the connection pads. The bonding pads are arranged to form at least one column in a direction in which the one side of the first semiconductor chip extends, and are not arranged in the routing area. The non-bonding pads are arranged to form a column different from the bonding pads. |
