ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER

摘要

The present disclosure relates generally to an electronic package and a method thereof. The electronic package comprises: an electrically conductive pad; a package insulator layer which includes a substantially non-conductive material and which is substantially planar; and a via. The via is formed within the package insulator layer and electrically coupled to the electrically conductive pad. The via comprises: a conductor extending vertically through at least a part of the package insulator layer and having a first end close to the electrically conductive pad and a second end opposite to the first end; and a finish layer which is fixed to the second end of the conductor and which includes a gold compound.