| 摘要 |
While suppressing the amount of supplied coating liquid coated on a substrate in a small amount, the coating liquid is uniformly coated into a substrate surface. A substrate processing apparatus (1) comprises: a moving mechanism (20) which moves a wafer (W) in a horizontal direction; coating units (30, 50) which eject the coating liquid to the wafer (W); dry units (40, 60) which dry the coating liquid on the wafer (W); and a control unit which controls the moving mechanism (20), coating units (30, 50), and dry units (40, 60). In each coating unit (30, 50), the wafer (W) is moved in the horizontal direction while causing the coating liquid to be in contact with the wafer (W) so that the coating liquid is coated on the entire surface of the wafer (W). |
