| 摘要 |
A wafer cleaning apparatus according to an embodiment of the present invention includes a washing bath in which a washing solution and a wafer to be washed are accommodated; a megasonic oscillator which is prepared on a lower side of the washing bath, and generates megasonic wave to a wafer side; and a wafer support part which supports the wafer, in the washing bath. The megasonic oscillator performs a first cleaning process by generating megasonic wave when the wafer is supported on the wafer support part, and a second cleaning process by generating megasonic wave when the wafer moves upwards by a predetermined distance from the wafer support part. |
