COMPOSITION FOR NON-CONDUCTIVE FILM AND NON-CONDUCTIVE FILM INCLUDING THE SAME

摘要

The present invention relates to a composition for a non-conductive adhesive film, and a non-conductive adhesive film comprising the same. More specifically, the composition has excellent curing properties at a high temperature and has excellent over-time stability at a room temperature in comparison with a conventional non-conductive adhesive film. The composition for a non-conductive adhesive film comprises a thermosetting resin and a curing agent, wherein the thermosetting resin comprises an alicyclic-based first epoxy resin and an alicyclic-based second epoxy resin and the curing agent comprises a fluorine-substituted type cation initiator.