发明名称 COOLING DEVICE FOR A PRINTED CIRCUIT BOARD.
摘要 The invention relates to a cooling device for a printed circuit board, comprising a printed circuit board equipped with at least one face or first face and at least one heat sink (9) brazed to said at least one face of the printed circuit, in which said at least one heat sink (9) can be disposed in a flow of coolant. The invention is suitable for motor vehicles. The invention relates to a cooling device for a printed circuit board, comprising a printed circuit board equipped with at least one face or first face and at least one heat sink (9) brazed to said at least one face of the printed circuit, in which said at least one heat sink (9) can be disposed in a flow of coolant. The invention is suitable for motor vehicles. The present invention relates to a process for the preparation of hydrophobically associating macromonomers M and to the novel macromonomers produced by the inventive method. The macromonomers M comprise a copolymerizable, ethylenically unsaturated group and a polyether structure in block form which comprises a polyethylenoxy block and a hydrophobic polyalkylenoxy block consisting of alkylenoxy-units with at least 4 carbon atoms. Optionally, the macromonomers M may comprise a terminal polyethylenoxy block. The macromonomers produced by the inventive method are suitable for reaction with other monomers, in particular with acrylamide, to form a water-soluble, hydrophobically associating copolymer.
申请公布号 MX2015007953(A) 申请公布日期 2016.02.19
申请号 MX20150007953 申请日期 2013.12.13
申请人 VALEO SYSTEMES THERMIQUES 发明人 CHAUVIN, KAREN;GOUMAIN, XAVIER;KIEL, FRIEDBALD
分类号 H05K7/20 主分类号 H05K7/20
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