发明名称 |
OXIDE FILM SCHEME FOR RRAM STRUCTURE |
摘要 |
The present disclosure relates to a method of forming an RRAM cell having a dielectric data layer that provides good performance, device yield, and data retention, and an associated apparatus. In some embodiments, the method is performed by forming an RRAM film stack having a bottom electrode layer disposed over a semiconductor substrate, a top electrode layer, and a dielectric data storage layer disposed between the bottom electrode and the top electrode. The dielectric data storage layer has a performance enhancing layer with a hydrogen-doped oxide and a data retention layer having an aluminum oxide. The RRAM film stack is then patterned according to one or more masking layers to form a top electrode and a bottom electrode, and an upper metal interconnect layer is formed at a position electrically contacting the top electrode. |
申请公布号 |
US2016049584(A1) |
申请公布日期 |
2016.02.18 |
申请号 |
US201414459361 |
申请日期 |
2014.08.14 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Dang Trinh Hai;Lin Hsing-Lien;Tsai Cheng-Yuan;Tsai Chia-Shiung;Lee Ru-Liang |
分类号 |
H01L45/00 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming an RRAM (resistive random access memory) cell, comprising:
forming an RRAM film stack having a bottom electrode layer disposed over a semiconductor substrate, a top electrode layer, and a dielectric data storage layer disposed between the bottom electrode and the top electrode, wherein the dielectric data storage layer comprises a performance enhancing layer having a hydrogen-doped oxide and a data retention layer comprising an aluminum oxide; patterning the RRAM film stack according to one or more masking layers to form a top elected and a bottom electrode; and forming an upper metal interconnect layer at a position electrically contacting the top electrode. |
地址 |
Hsin-Chu TW |