发明名称 OXIDE FILM SCHEME FOR RRAM STRUCTURE
摘要 The present disclosure relates to a method of forming an RRAM cell having a dielectric data layer that provides good performance, device yield, and data retention, and an associated apparatus. In some embodiments, the method is performed by forming an RRAM film stack having a bottom electrode layer disposed over a semiconductor substrate, a top electrode layer, and a dielectric data storage layer disposed between the bottom electrode and the top electrode. The dielectric data storage layer has a performance enhancing layer with a hydrogen-doped oxide and a data retention layer having an aluminum oxide. The RRAM film stack is then patterned according to one or more masking layers to form a top electrode and a bottom electrode, and an upper metal interconnect layer is formed at a position electrically contacting the top electrode.
申请公布号 US2016049584(A1) 申请公布日期 2016.02.18
申请号 US201414459361 申请日期 2014.08.14
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Dang Trinh Hai;Lin Hsing-Lien;Tsai Cheng-Yuan;Tsai Chia-Shiung;Lee Ru-Liang
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项 1. A method of forming an RRAM (resistive random access memory) cell, comprising: forming an RRAM film stack having a bottom electrode layer disposed over a semiconductor substrate, a top electrode layer, and a dielectric data storage layer disposed between the bottom electrode and the top electrode, wherein the dielectric data storage layer comprises a performance enhancing layer having a hydrogen-doped oxide and a data retention layer comprising an aluminum oxide; patterning the RRAM film stack according to one or more masking layers to form a top elected and a bottom electrode; and forming an upper metal interconnect layer at a position electrically contacting the top electrode.
地址 Hsin-Chu TW