发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and a plasma processing method, capable of quickly stabilizing plasma after switching of steps so as to enable a proper plasma processing.SOLUTION: A controller 16 disclosed herein drives, in a first step, a high frequency generating source 1 at a first energy condition, and drives, in a second step, the high frequency generating source 1 at a second energy condition. Prior to a switching time of the first step and the second step, the controller switches gas species supplied from a gas supply system 11 into a processing container 8, and sets a gas flow rate in an initial period just after the switching to be larger than a gas flow rate in a stabilization period after lapse of the initial period.SELECTED DRAWING: Figure 1
申请公布号 JP2016027592(A) 申请公布日期 2016.02.18
申请号 JP20140186820 申请日期 2014.09.12
申请人 TOKYO ELECTRON LTD 发明人 FUNAKUBO TAKAO;HAGA HIROBUMI;KOZUKA SHINICHI;OZAWA WATARU;SAKAMOTO AKIHIRO;TANIGUCHI NAOKI;TSUJIMOTO HIROSHI;ONO KUMIKO
分类号 H01L21/3065;C23C16/509;C23C16/52;H01L21/205;H01L21/31;H05H1/46 主分类号 H01L21/3065
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