| 发明名称 |
HOT-ROLLED COPPER PLATE |
| 摘要 |
A hot-rolled copper plate consists of pure copper having a purity of 99.99 mass % or greater, the hot-rolled copper plate having an average crystal grain diameter of 40 μm or less, and a (Σ3+Σ9) grain boundary length ratio (L σ3+σ9)/L), which is a ratio between a total crystal grain boundary length L measured by an EBSD method and a sum L (σ3+σ9) of a Σ3 grain boundary length Lσ3 and a Σ9 grain boundary length Lσ9, being 28% or greater. |
| 申请公布号 |
US2016047017(A1) |
申请公布日期 |
2016.02.18 |
| 申请号 |
US201414782177 |
申请日期 |
2014.04.08 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
MAKI Kazunari;MORI Hiroyuki;ARAI Isao;IIDA Norihisa;TAKEDA Takahiro;SHIMOIZUMI Shigeru;OIKAWA Shin |
| 分类号 |
C22C9/00;C22F1/08 |
主分类号 |
C22C9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A hot-rolled copper plate consisting of pure copper having a purity of 99.99 mass % or greater, the hot-rolled copper plate having an average crystal grain diameter of 40 μm or less, and a (Σ3+Σ9) grain boundary length ratio (L(σ3+σ9)/L), which is a ratio between a total crystal grain boundary length L measured by an EBSD method and a sum L (σ3+σ9) of a Σ3 grain boundary length Lσ3 and a Σ9 grain boundary length Lσ9, being 28% or greater. |
| 地址 |
Tokyo JP |
